Electronic Assembly Services of printed circuit boards is a process that requires attention to minute details. In simple terms, assembly of PCBs is done once designing and bare board fabrication is complete. Each of the Electronic Assembly Service components needs to be placed with correct orientation to form an operational printed circuit board.
? SMT (Surface Mount Technology): The Electronic Assembly Service components are placed and soldered on substrate (pads) of the outer surface of circuit board;
? Through-Hole Technology: The Electronic Assembly Service component leads are inserted through holes that are already made on the substrate of the printed circuit board.
Important Aspects of Printed Circuit Board Assembly Services
In order to carry out PCB assembly services with efficiency and precision, you need to take into consideration certain important aspects:
Stay Loyal to the PCB Design: Once the design of your circuit board is finalized, it is important to stick to that design and place the components accordingly. If you follow the racks and locations properly, then your assembled PCB will be devoid of any flaws.
Keep the Polarity of Components in Mind: While placing the components on the circuit board, always keep in mind their polarity and adjust them at both negative and positive ends. This will prevent any electrical or functional failures in the PCB.
Solder Bulky Components Prior to Smaller Ones: It is advisable to solder the bulky and large components before the smaller ones. Once all the bulky components are soldered and fixed in their places then with the help tweezers and adhesives, solder the smaller components one at a time.
Test the Functioning of PCB: After the final assembly, it is prudent to check the functioning of the PCB. You can also scrutinize the circuit board for any loose connections or unattached Electronic Assembly Service components.
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目前分類：Electronic Assembly Service (2)
- Jul 10 Thu 2014 08:45
Important Aspects of Printed Circuit Electronic Assembly Services
- Jul 09 Wed 2014 08:44
When overmolding an entire Electronic Assembly Service assembly, several dissimilar materials are encapsulated
With the use of innovative packaging techniques and recent advances in epoxy thermoset materials, transfer molding can be used to form a plastic package to encase the entire product Electronic Assembly Service assembly. The application of flip chip and μBGA packages has enabled the form factor of the automotive Electronic Assembly Service controller to be reduced by as much as 75 percent. With this reduction in package size, it becomes economically feasible to use thermoset epoxy to overmold the entire circuit board assembly.
The overmold Electronic Assembly Service packaging concept consists of a PCB assembly populated with flip chips and other surface mount components adhesively mounted to a metal backplate, which is then overmolded to form the Electronic Assembly Service enclosure. One of the biggest challenges was to develop methods to incorporate a product connector header in the molded module.
When overmolding an entire Electronic Assembly Service assembly, several dissimilar materials are encapsulated. The material properties of the PCB, metal backplate, silicon flip chips and other surface mount components have to be taken into account. Properties of the thermoset epoxy are chosen to prevent inadvertent interactions with any of the materials being molded. The thermoset material properties were optimized, with the most important of these being CTE and modulus. The selected material was an adequate match to the backplate and PCB assembly, because no delamination occurred after temperature cycling.
Finally, several other manual assembly steps related to casing the module can be removed from the manufacturing process by overmolding the product in plastic. If materials properties of the system components are carefully chosen, product reliability can increase by nearly two times. Using a transfer mold process to form the enclosure can result in a cost-effective Electronic Assembly Service packaging solution..
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