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With the use of innovative packaging techniques and recent advances in epoxy thermoset materials, transfer molding can be used to form a plastic package to encase the entire product Electronic Assembly Service assembly. The application of flip chip and μBGA packages has enabled the form factor of the automotive Electronic Assembly Service controller to be reduced by as much as 75 percent. With this reduction in package size, it becomes economically feasible to use thermoset epoxy to overmold the entire circuit board assembly.

The overmold Electronic Assembly Service packaging concept consists of a PCB assembly populated with flip chips and other surface mount components adhesively mounted to a metal backplate, which is then overmolded to form the Electronic Assembly Service enclosure. One of the biggest challenges was to develop methods to incorporate a product connector header in the molded module. 

When overmolding an entire Electronic Assembly Service assembly, several dissimilar materials are encapsulated. The material properties of the PCB, metal backplate, silicon flip chips and other surface mount components have to be taken into account. Properties of the thermoset epoxy are chosen to prevent inadvertent interactions with any of the materials being molded. The thermoset material properties were optimized, with the most important of these being CTE and modulus. The selected material was an adequate match to the backplate and PCB assembly, because no delamination occurred after temperature cycling.

Finally, several other manual assembly steps related to casing the module can be removed from the manufacturing process by overmolding the product in plastic. If materials properties of the system components are carefully chosen, product reliability can increase by nearly two times. Using a transfer mold process to form the enclosure can result in a cost-effective Electronic Assembly Service packaging solution..
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